| Transistor Stacking and Future Packaging Technologies |
| No. | Name | Title | |
| 1 | Yu-Chun Chen | Large-Area Single-Crystalline Silicon/Germanium Film Using Laser Crystallization for Monolithic 3DICs Platform |  |
|
2
| Ying-Qi Liu | Strain Evolution in SiGe Nanosheet Transistor Process Flow |  |
|
3
|
Chu-Hsiu Hsu
| Monolithic Hybrid-3D Standard Cell Library with Sandwiched Inter-Metal Layer for 3D Digital Computation-in-Memory Circuits |  |
|
4
|
Huai-En Lin
| Inspection, Design, and Improvement of Hybrid Bonding in 3D IC Fabrication Using In-situ Heating Atomic Force Microscopy |  |
|
5
| Hua-Jing Huang | Atomic-Scale Investigation of Electromigration Behavior in Cu-to-Cu Joints at High Current Density |  |
|
6
| Hsuan-Hsiao Liu | Elimanated Nanotwinned Copper Bonding Interfaces Through Epoxy-Induced Fine Grains on Copper Surface |  |
|
7
| Chi-Ting Huang | Electrical Conductivity of Nanotwinned Copper Joints: A First-Principles and Boltzmann Transport Study |  |
|
8
| Ping-Chun Kuo | High strength and highly (111)-oriented nanotwinned Ag thin films on SiC substrate |  |
| Oxide Semiconductor Devices and Applications |
|
No.
|
Name
|
Title
| |
|
9
|
Wei-Kai Yu
|
IGZO-Based 2T-DRAM with Positive Threshold Voltage and Long Retention
|  |
|
10
|
Tsung-Che Chiang
|
High Performance P-type Tin monoxide Thin Film Transistor for Back-end of Line Applications
|  |
|
11
|
Yu-Cheng Chang
|
Breaking the trade-off between mobility and on-off ratio in oxide thin-film transistors
|  |
|
12
|
Xin-Ren Yu
|
Investigation of High-Performance Germaniunm-on-Insulator (GeOI) GAAFETs Fabricated through Wafer Bonding
|  |
|
13
|
Yun-Hao Yeh
|
Cryogenic Measurement on the Electrical Properties of Sputter-deposited Indium Gallium Zinc Oxide Thin-film transistors
|  |
|
14
|
Liang-Zi Yao
|
Implementation of Density Functional Theory (DFT) and Artificial Intelligence (AI) in Indium Tin Oxide (ITO)
|  |
| 2D/1D Semiconductor Devices: Experiment |
|
No.
|
Name
|
Title
| |
|
15
|
Sen-Hao Chang
| Interface Property of Metals and Semimetals Contact Transition Metal Dichalcogenides |  |
|
16
|
Bo-Wei Chen
| Interfacial nanobubbles induce doping behavior of SL-MoS2 on Au(111) |  |
|
17
|
Yen-Yu Lai
| WSe2 defect engineering by Ne ion bombardment and growth of semimetal Sn |  |
|
18
|
Ting-Yu Pan
| Exploring effects of stress and strain on electron transport and field-effect performance of few-layer MoS2 |  |
|
19
|
Shin-Lin Tsai
| Realization of low contact resistance on MoS2 field-effect transistors using low melting point metals and semimetals |  |
|
20
|
Jia-Hao Chih
| Optimizing WSe2 Double Gate FETs with Low-Temperature PE-AlN/TH-HfO2 Gate Dielectrics and Post-Annealing Treatment |  |
|
21
|
Shin-Yuan Wang
| Conformal bilayer h-AlN epitaxy on WS2 as an interfacial layer with ultralow leakage current |  |
|
22
|
Hui-Ting Liu
| Growth Behavior of Ni on Hydrogen-Crack WS2 Surface |  |
|
23
|
Yu-Che Huang
| Long range van der Waal epitaxy of Au / MoS2 moiré superlattices at room temperature |  |
|
24
| Qian-Yo Lee |
Synthesis and Doping of 2D Semiconductors by MOCVD
|  |
| 2D/1D Semiconductor Devices: Simulation |
|
No.
|
Name
|
Title
| |
|
25
|
Shao-Chen Hwu
|
Anisotropic Transition-Metal Nitride van der Waals Epitaxy on Two-Dimensional Matrials: A First-Principles Study
|  |
|
26
|
Zi-Che Yang
|
Interface-doping Effects and Gate-length Dependence of TMD/Metal Contacts
|  |
|
27
|
Ken-Ming Lin
| Efficiency of Gate Control in Short-Channel Pt-WSe2-Pt Nanojunctions: A First Principles Study |  |
|
28
|
Sylvia Qingyu Cai
|
Electron Transport through InSe/Metal Heterostructures
|  |
|
29
|
Tsung-Mu Wu
|
First-principles calculation of interfacial characteristics between contact metal and two-dimensional materials
|  |
| Ferroelectric Materials and Devices |
|
No.
|
Name
|
Title
| |
|
30
|
Jie-Ni Dai
|
Design Space Exploration for Interfacial-Layer-Free Negative-Capacitance FET
|  |
|
31
|
Cheng-Yu Yu
|
Comparative Analysis of Ferroelectric Properties and Reliability in MFM Capacitors with Varied HZO Layer Thicknesses
|  |
|
32
|
Ming-Lun Tsai
| Seed-layer Effects on the Ferroelectric Properties of Hf1-xZrxO2 Thin Films |  |
|
33
|
Yu-Tsung Liao
|
Engineering HZO by Flat Amorphous TiN Achieving Uniform c-axis Alignment, High Breakdown Field, and Endurance > 4E12
|  |
|
34
|
Li-Cheng Teng
|
Demonstration of BEOL-Compatible Ferroelectric 6.5 nm HZO Capacitor with High Endurance and Retention
|  |
| III-V Semiconductor Devices and Novel Materials Applications |
|
No.
|
Name
|
Title
| |
|
35
|
Mu-Yu Chen
|
Improving NDR and RF Characteristics of InGaAs MOSFETs through Ferroelectric Thickness Tuning for Enhanced Energy Efficiency
|  |
|
36
|
Howie Tseng
|
Study of Low Noise and High Linearity AlGaN/GaN HEMT with Ti/Al/Ti/W Au-free Ohmic Contact
|  |
|
37
|
Chun-Yi Hsia
|
Reliability Study of Ir-Sputtered GaN Power Amplifier MMIC Under High Level RF Input Drive at Elevated Temperatues
|  |
|
38
|
Jing-Yuan Tsai
| Electric-Field Induced Structural Transition in HighPerformance High Entropy Oxide-Based Memristor |  |
| 39 |
Yu-Hao Wu
| Visualization of Eu2+/Eu3+ coactivated BaAl2O4 phosphor using X-ray nanoprobe beamline at TPS 23A |  |
| 40 | Shuo-Ting Hsu | Distribution of TiC Nanoceramic Particles and Microstructural Properties of 7075 Aluminum Alloy |  |
| 41 | Kris K.H. Lin | Achieving Low Contact Resistance in MoS2 nFET with van der Waals epi Au |  |