Theme I: IC Transistor Stacking with Versatile Channels and Gates
Coordinator: Chee-Wee Liu (NTU)
Participants: Po-Tsang Huang (NYCU), Chih-ChaoYang (TSRI), Chang-Hong Shen (TSRI)
Theme II: Ferroelectric Materials and Devices
Coordinator: Yuan-Chieh Tseng (NYCU)
Participants: Chee-Wee Liu (NTU), Pin Su (NYCU), Shu-Jui Chang (TSMC)
Theme III: 2D/1D-Semiconductor Devices Targeting 2030 Technology
Coordinator: Chao-Hsin Chien (NYCU)
Participants: Wen-Bin Jian (NYCU), Chun-Liang Lin (NYCU), Yu-Chuan Lin (NYCU), Shu-Jui Chang (TSMC)
Theme IV: Future Semiconductor Packaging Technologies
Coordinator: Chih Chen (NYCU)
Participants: Kuan-Nerng Chen (NYCU), Fan-Yi Ou Yang (NTHU), Wen-Wei Wu (NYCU), Yu-Chien Lo (NYCU), Tsai-Fu Chung (NYCU)
Theme V: 3D High-density Oxide Semiconductor CMOS and Applications
Coordinator: Yuan-Chen Sun (NYCU)
Participants: Tuo-Hung Hou (TSRI), Po-Tsun Liu (NYCU), Der-Hsien Lien (NYCU), Yao-Jen Lee (NYCU), Chao-Cheng Lin (TSRI)
Theme VI: Future GaN/Si RF HEMTs for Ubiquitous Satellite Communication
Coordinator: Edward Yi Chang (NYCU)
Participants: Heng-Tung Hsu (NYCU), Tsai-Fu Chung (NYCU), Yueh-Chin Lin (NYCU), Chun-Hao Chen (NYCU)